Jofre Labortechnik

  • Увеличить размер шрифта
  • Размер шрифта по умолчанию
  • Уменьшить размер шрифта
Home Technology and equipment Soldering paste application
Soldering paste application

More than 60% of defects arising in the process of SMT mounting are connected namely with the problems originated during soldering paste application. That is why we give special consideration to this stage. For soldering paste application, subject to the volume of order, material and stencil design, stencil printers are used: manual, semi-automatic ASYS ASPM or automatic MPM AP-25 EXCEL.

Our tools provide flexible approach to the customer’s needs. In some cases, at small volume of orders, it is possible to avoid excessive costs and time on manufacturing complicated and expensive stencils, in other cases – to ensure high quality, rate and frequency of soldering paste application, in combination with stringent control of a process before starting the product assembly.

The essential issue providing high quality of this production stage is application of high-quality materials and soldering pastes, selected according to PCB design, type of mounted components and temperature specifications during solder reflow.

Semi-automatic printer ASYS ASPM

  • easy resetting for new production;
  • low cost of stencils;
  • exact positioning by X, Y-direction and by micrometer screw rotation;
  • convenient PCB fixing, in particular, double-sided PCBs on magnetic pins;
  • adjustable squeegee pressure;
  • double-sided PCB fixing device.


Automatic printer MPM AP-25 EXCEL for soldering paste application
  • Maximum Board Size (X x Y) 508 mm x 406 mm
  • Minimum Board Size (X x Y) 50.8 mm x 50.8 mm
  • Board Thickness 0.51 mm to 12.7 mm
  • Maximum Printing Area (X x Y) 457.2 mm x 406.4 mm
  • Print Force 0.45 kg (1 lbs) to 27.2 kg (60 lbs)
  • 2D – optical control of soldering paste application quality





Home Technology and equipment Soldering paste application