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Home Contract manufacture Fine Pitch component-mounting on pilot products
Fine Pitch component-mounting on pilot products

The processing complexity of the installation conditioned by microcircuit design in BGA, Flip-Chip and CSP packages determines high requirements to the process of their mounting. However, the application of a complete automated cycle at mounting of single products and small pilot batches is economically inexpedient.

MPL 3100 device by ESSEMTEC is used for installation of these microcircuits or QFP microcircuits with fine lead-out pitch at pilot or small-batch orders.

The combination of visual inspection system equipped by two-colour LED illumination and CCD camera with a monitor for fine components enables more accurate alignment of a mounted PCB surface image with a real contact under-surface of a component before its setting. A rigid structure of the device and motorized X, Y, R and Z-directed drives provide fine positioning of components.

Our capabilities:

  • BGA, mBGA, Flip-Chip and CSP microcircuits mounting with lead-out pitch to 0.5 mm and package size to 70*70 mm.
  • Microcircuit mounting to the boards having other elements installed.





Home Contract manufacture Fine Pitch component-mounting on pilot products