JOFRE | Technologies and equipment

Technologies and equipment

SMD assembling


  • Two SMD lines with a capacity of 140,000 components per hour
  • Component size from 0.4 x 0.2 mm to 55 x 55 mm
  • Maximum component height up to 20 mm
  • Maximum PCB size 640 x 460 mm
  • Placement accuracy 37.5 µm
  • Automatic paste dispenser
  • 13-zone hot air convection reflow ovens, with the ability to solder in a nitrogen environment
  • The ability to work with components in matrix trays

AOI and X-ray

Automatic optical inspection

 

  • High precision and inspection rate
  • Solder quality measurement control
  • Inspectable PCB’s size 50 × 50mm (min.) to ~ 430×330 мм (max.)
  • Thickness 0.3 to 5 mm
  • PCB Height Clearance Top Side: 30 mm, Bottom Side: 65 mm
  • 20µm/Pixel FOV: 32.56×24.72, Speed<210ms/FOV
  • 15µm/Pixel FOV: 24.42×18.54 Speed<190ms/FOV

 

X-ray inspection

 

  • Detailed inspection of vias, through hole plating and multi-layer alignment
  • BGA inspection
  • LED inspection for voids

THT assembling

Two automatic wave soldering machines

 

  • Flexible volumes and program mix
  • Leaded or lead-free processes

 

20 working places for manual assembly

 

  • Soldering stations Solomon, PACE, Metcal
  • Automated injection molding machine controls
  • Multi-piece dividers of PCBs made by the method of v-scoring and milling

Cleaning for electronic assembling


  • Closed-loop system with integrated DI
  • Cleaning unit with rotating spray arms in a closed circuit
  • Stencil cleaning
  • Line of ultrasonic cleaning baths with additional turbojet wash

Functional testing


  • 8 workplaces for product testing
  • In-house test equipment design
  • Isolation resistance measurement
  • Grounding tests
  • Leakage current tests

Conformal coating and potting

Conformal coating

  • Automatic line for selective coating
  • Modern workplace for manual coating
  • Quality control in ultraviolet light
  • Work with one-component and two-component materials

 

Potting

  • Two automatic high-performance potting machines with one- or two-component compounds
  • Max. working area 3000 x 750 x 100 mm
  • Accuracy +/- 0,5 mm
  • Performance speed from 0.8 to 3.0 g/sec.
  • Max speed 150 mm/sec.
  • Two semi-automatic hermetic sealing machines with two-component silicone compounds

Assembling


  • Complex product integration
  • Casing and packaging
  • Ultrasonic welding
  • Cabling
  • Printing of labels, barcodes, and QR codes

Burn-in testing, temperature and climatic testing


  • Automated bench test equipment for operating time of electronic products
  • Large selection of cooling and heating chambers with an operating temperature range of -80°C to 200°C
  • Prommagrable environmental testing chamber

Mechanical workshop


  • High precision drilling, grinding, lathe and milling
  • Surface treatment
  • Aluminium parts anodizing
  • CNC milling with 3D-machine
  • CNC machining center Phantomatic T3 with 3 controlled axes

Quality control


  • Visual quality inspection at all stages of a production cycle
  • Compliance with design and technical documentation
  • Compliance with IPC standards
    Read more about quality

Rework


  • Rework of all SMD component packages
  • Balling & reballing
  • PCB rework on metal substrate
  • Vacuum sealing
  • Visual inspection

Packaging


  • Automatic void-filling material machine AIRPAD
  • Automatic preparation of reinforced adhesive paper masking tape
  • Package welding machines
  • Cutting equipment for cardboard and foamed polyethylene
  • Use of antistatic materials